The required 12 months of experience in an engineering capacity e.g. development engineer, process engineer, electrical engineer, or related must include the following Handson experience with high power diode lasers; Process and technology development of die bonding and wire bonding; Use of statistical software packages JMP, Minitab, or comparable for Statistical Process Control SPC; Failure analysis tools such as FIB, SEM, CSAM; Operating and troubleshooting packaging equipment.
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