TEXAS INSTRUMENTS INCORPORATED – $129,709.00/Year

Masters or foreign equivalent degree in Materials Science and Engineering, Mechanical Engineering, or a related field and 6 years of experience in semiconductor materials packaging design, development, and manufacturing. Experience to include 5 years w Masters or Bachelors in bumping and flip chip technology; silicon processing development; and, silicon packaging interaction OR, a Bachelors or foreign equivalent degree in Materials Science and Engineering, Mechanical Engineering, or a related field and 8 years in semiconductor material and packaging design, development, and manufacturing. Experience to include 5 years w Masters or Bachelors in bumping and flip chip technology; silicon processing development; and, silicon packaging interaction. Employer will accept any suitable combination of education, training, or experience.