Knowledge or experience to includebr br 1. Test chip layout experience;br 2. High band gap device physics;br 3. Device modeling and characterization in highvoltage, BCD, LDMOS, Bipolar or CMOS technologies for power management applications;br 4. MOSFET or Bipolar;br 5. Power, DC or RF characterization of active and passive devices;br 6. SPICE model extraction, simulation and EDA tool implementation
Categories: eb3
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