Three 3 years of experience inbr br 1. IC packages such as QFP, QFN, BGA, flip chip, and wafer level packaging FO, WLCSP.br 2. Statistical Analysis and Design of Experiment.br 3. Qualification of semiconductor package technology.br 4. Semiconductor packaging related reliability tests.br 5. Failure analysis techniques necessary to drive root cause analyses of package related failures.br br H.7A Alternate fields of study Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, foreign equivalent or related field.
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