Experience with semiconductor equipment; handson fab experience and utilizing background in semiconductor manufacturing processes; advanced metrology technologies, especially optical technologies; problemsolving; interpersonal, communication and leadership skills; FAB chips fabrication process; Semiconductor device physics; new process tuning and integration; Inline process control metrology techniques; and OCD Metrology experience.br br EDUCATION Masters degree or foreign equivalent in Computer Engineering, Electronic Engineering, Mechanical Engineering, Microelectronics, Material Science, Physics or related field.br br TELECOMMUTINGTRAVEL 10 mainly domestic and occasional international travel.
Categories: eb3
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