Requires a Masters degree in Electrical Engineering, Electronic Engineering, or a related field and 6 years of power semiconductor device design, characterization and processing experience. Must have experience in Use of semiconductor physics and the parameters of electronic devices that will affect their electrical characteristics, and their performance in common application circuits such as DC Buck converters; SPICE model parameters that describe the device behaviorally in electrical circuit simulations; Utilizing Process Flows and Fabrication steps used in semiconductor foundries fabrication plants to achieve practical and reliable Power MOSFET device structures; Silicon Power MOSFET device technologies for 12250V class devices; Interpreting physical SEM, TEM, EDX and electrical Datasheets, Evaluation and Application test analysis of Power MOSFETs to determine their performance and manufacturing process; Using Technology CAD TCAD simulation tools Synopsys Sentaurus Process and Device to simulate the Process Flow used in device fabrication and the resulting electrical characteristics of power devices; Working with UnixLinux based operating systems; Performing layout design based on limitations set by foundries and internal design rules using an industry standard tool; Reviewing layout designs against the design rules using Klayout or equivalent tool; Cp, Cpk and StatisticalProcessControl SPC; Statistical Analysis of simulation and experimental data using JMP analysis tool; Characterization of power MOSFET at wafer level, and of packaged parts using parameter analyzers, Wafer probers, etc.; and Collaborative working with international teams.br br Infineon requires all new U.S. employees contractors to be fully vaccinated against COVID19. Anyone unable to be vaccinated, either because of a sincerely held religious belief or a medical condition or disability that prevents them from being vaccinated, can request a reasonable accommodation.
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