48 months in the following PCBA printed circuit board assembly yield failure assessment, root cause analysis, and prevention; PCBA printed circuit board assembly DFM designformanufacturability design review, issue identification, and correction; PCBA printed circuit board assembly DOE design of experiments; Assessment of lab failure analysis including DP die and pry and crosssectioning; PCBA printed circuit board assembly reflow profile and stencil printing development; IPCA610; CAM350; Cadence Allegro; Solder paste metallurgy assessment; and Six Sigma quality methods. Parttime telecommuting allowed.
Categories: eb3
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