SPECIAL REQUIREMENTS Position requires education or experience with the following technologies andor skills CAD tools AutoCAD, SolidWorks, Python, Matlab, flipchip bonding pick and place with mass reflow assembly process, thermocompression bonding, solder paste printing, finite element modeling, Scanning Electron Microscopy SEM, Energy Dispersive XRay Spectroscopy EDX,XRay Photoelectron Spectroscopy XPS, Differential Scanning Calorimetry DSC, XRay Diffraction XRD, Cmode scanning acoustic microcopy CSAM, Shadow Moire warpage technique, reliability testing and failure analysis in semiconductor packages, electroless metal deposition, electrolytic metal deposition, physical vapor deposition sputtering, plasma reactive ion etching RIE, thin film lamination, lithography, and goniometry.br br Skills may be gained concurrently. Employer will accept skills gained in furtherance of university degree via coursework, projects, internships, research, theses, etc.
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