AVP TECHNOLOGY, LLC – $85,966.00/Year
1. Strong ability in characterizing materials and materials processes.br 2. Solid knowledge in thin film deposition and metrology methods.br 3. Good analytical and communication skills.
1. Strong ability in characterizing materials and materials processes.br 2. Solid knowledge in thin film deposition and metrology methods.br 3. Good analytical and communication skills.
Bachelors degree in Electrical Engineering, Electronics Engineering, Physics, or a related field. Must have work or academic experience with Electrical, thermal and mechanical characteristics of integrated circuits, components, subcomponents and systems to determine root cause of failure; Circuit boards, processors, chips, electronic equipment, and electronic hardware; Hands on practices on Read more…
Contd from H.12 Job requirements are normal for the employer due to the complexity of job duties associated with this position. Employer answered quot;noquot; to Question H.12 based on SVP analysis only.br br Work experience to include 1. Four years of experience in a team lead capacity. 2. Four years Read more…
Knowledge of ArchiCAD, AutoCAD, Revit, Sketchup, Twinmotion, VRAY, Adobe Suite.br Certificate in Technical Drawingbr Certificate in Archicad MEP Modeler
Employer will accept any suitable combination of education, training, or experience.br br Experience in H.6 or H.10 to include 1 network design to include DWDM, SONETSDH technologies; and 2 design validation and project deployment of IP and Optical solutions or installation, commissioning and testing of Synchronous Optical Network SONET and Read more…
Education Masters degree or foreign degree equivalent in Computer Science, Engineering, Math, Information Systems, Physics or related.br Experience 36 months of experience in any computer related occupation.br Skills 36 months of experience in FPGA, RTL, SOC, Verilog, Vivado, WaveformsLab Debug, and FPGA DesignArchitecture.
Candidate must also have academic or industry experience in seven 7 of the following skills Verilog or SystemVerilog; Perl or Python or TCL; Computer Architecture; RTL to GDS; IR Drop Analysis; CPU Architecture; Static Timing Analysis; Timing Closure; Place and Route.br br Telecommuting may be permitted. When not telecommuting, must Read more…
Candidate must also have academic or industry experience in seven 7 of the following skills Electromagnetic Theory and Antennas and EMC Design; Computational Electromagnetics; QuasiStatic and FullWave 3D EM Simulation Tools; Test Equipment, including Vector Network Analyzers and Oscilloscopes and Spectrum Analyzers; Matlab or C Coding; HighFrequency Electromagnetic Waves Interaction Read more…
Candidate must also have academic or industry experience in seven 7 of the following skills ASIC Digital Design; Algorithm Development; Microarchitecture; Logic Design; RTL Coding; Functional Design; Gate Level Simulation; Code Coverage; Verilog or SystemVerilog.br br Telecommuting may be permitted. When not telecommuting, must report to Qualcomms office locations in Read more…